Description Flexible Module Formats, Suitable for Multiple Scenarios.Different versions meet the requirements of DG and Utility.High efficiency, lower BOS costs.M10 Ga-doped wafer & Crackless smart soldering technology. Maximum power (Pmax): 560 W; Open-circuit voltage (Voc): 50.10 V; Size: 2278×1134×35mm; Smart Soldering Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity. Optimized Module Size M10 wafer and 54 cell design, fully considering the size and weight of modules in distributed applications Gallium-doped Technology Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module. Smart Module Packaging and Logistics Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics. Optimized Electrical Parameters The working current is about 13A, which is perfectly adapted to mainstream string inverters. Layout: 144 (6×24)Junction box: IP68, split type, 3 diodesWeight: 27.5kgSize: 2278×1134×35mmPackaging: 31 pcs./pallet, 155 pcs./20GP, 620 pcs./40 GP Download Datasheet
